ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,116, issued on Oct. 7, was assigned to HANWHA PRECISION MACHINERY Co. LTD. (Changwon-si, South Korea).
"Bonding apparatus and method of controlling the same" was invented by Tae Woo Kang (Changwon-si, South Korea), Ji Hwan Bae (Changwon-si, South Korea) and Yong Hyun Lee (Changwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a bonding apparatus and a method of controlling the bonding apparatus. The bonding apparatus includes a bonding head, a wafer chuck configured to receive a wafer thereon, and at least one bonding stage cover disposed above the wafer chuck."
The patent was filed on Aug. 16, 2022, under Application N...