ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,550, issued on Oct. 21, was assigned to HANSOL CHEMICAL Co. LTD. (Seoul, South Korea).
"Dual-curable adhesive composition" was invented by Chanho Shin (Gwangju, South Korea), Joohan Woo (Jeonju-si, South Korea), Cheolwoo Lee (Jeollabuk-do, South Korea), Sungmin Ha (Jeollabuk-do, South Korea) and Chunrae Nam (Jeonju-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a dual-curable hybrid adhesive composition including a photo-initiator, a thermal initiator, and a thiol group-containing compound, and more particularly, to an adhesive composition which may be cured through a single curing by ultraviolet (UV) l...