US Patent Issued to HANON SYSTEMS on March 11 for "Vapor injection module and heat pump system using same" (South Korean Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,246,579, issued on March 11, was assigned to HANON SYSTEMS (Daejeon, South Korea).

"Vapor injection module and heat pump system using same" was invented by Seong Hun Kim (Daejeon, South Korea), Sung Je Lee (Daejeon, South Korea) and Hae Jun Lee (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A vapor injection module may include an expansion valve configured to allow a condensed refrigerant to pass therethrough or expand a condensed refrigerant in accordance with an air conditioning mode, and a gas-liquid separator configured to receive the refrigerant from the expansion valve and separate the refrigerant into a gaseous refrigerant ...