ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,763, issued on Feb. 3, was assigned to HANON SYSTEMS (South Korea).
"Vapor injection module and heat pump system using same" was invented by Yun Jin Kim (Daejeon, South Korea), Seong Hun Kim (Daejeon, South Korea), Sung Je Lee (Daejeon, South Korea) and Hae Jun Lee (Daejeon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a vapor injection module having a first expansion device that either stops or expands the flow of condensed refrigerant and sends it to a gas-liquid separator. The gas-liquid separator then separates the refrigerant into gas and liquid parts. A second expansion device allows the condensed re...