US Patent Issued to HANGZHOU SIZONE ELECTRONIC TECHNOLOGY on Sept. 30 for "Wafer conveying device, chemical mechanical planarization apparatus and wafer conveying method" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,427,619, issued on Sept. 30, was assigned to HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC (Zhejiang, China).

"Wafer conveying device, chemical mechanical planarization apparatus and wafer conveying method" was invented by Yuansi Yang (Zhejiang, China) and Zhipeng Zhou (Zhejiang, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer conveying device, a chemical-mechanical planarization device and a wafer conveying method; the wafer conveying device comprises a manipulator used to clamp and transport wafers, as well as a transfer platform used to place the wafers; the manipulator consists of a 1st claw, a 2nd claw, a lifting platform, a movement mech...