ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,674, issued on Nov. 25, was assigned to HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC. (Zhejiang, China).

"Wafer cleaning and drying device" was invented by Linghan Shen (Zhejiang, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer cleaning and drying device includes: a box used to clean the wafer, an opening is arranged at the top of the box for the wafer to enter or exit the box; a support part arranged inside the box and used to hold the wafer, the support part can move upward and downward; a spraying pipe arranged at the opening and used to spray the drying gas onto the surface of the cleaned wafer. The wafer cleaning and drying device dri...