US Patent Issued to HANGZHOU SIZONE ELECTRONIC TECHNOLOGY on March 18 for "Chemical mechanical planarization equipment, wafer transfer method, and wafer planarization unit" (Chinese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,251,785, issued on March 18, was assigned to HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC. (Zhejiang, China).

"Chemical mechanical planarization equipment, wafer transfer method, and wafer planarization unit" was invented by EdwardLiCang Lee (Zhejiang, China) and Jingran Gu (Zhejiang, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chemical-mechanical planarization equipment, comprising a polishing module, a cleaning module and a wafer transfer module, wherein the polishing module comprises two rows of polishing unit arrays, each row of polishing unit arrays comprises two or more sets of polishing units, polishing transfer stations corresponding to...