ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,400, issued on Feb. 17, was assigned to HANGZHOU FIRST APPLIED MATERIAL Co. LTD. (Zhejiang, China).
"Encapsulation adhesive film" was invented by Xiang Chen (Zhejiang, China) and Haiyun Wu (Zhejiang, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure discloses an encapsulation adhesive film 100, comprising an adhesive film body and a surface pattern provided on at least one surface of the adhesive film body, and the surface pattern comprising a first pattern extending basically along a first direction and a second pattern extending basically along a second direction, the first direction intersecting the second direction at a...