ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,121, issued on March 18, was assigned to HAMILTON SUNDSTRAND Corp. (Charlotte, N.C.).
"Power semiconductor cooling assembly" was invented by Sebastian Pedro Rosado (Nuremberg, Germany) and Karthik Debbadi (Kronshagen, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power switch module includes a semiconductor die and a conductive busbar. The semiconductor die is electrically conductively mounted to the busbar. The module also includes a dielectric coolant fluid and the busbar and the semiconductor die mounted thereto are immersed in the dielectric coolant fluid. The module can be include in a power converter assembly."
The patent was file...