ALEXANDRIA, Va., April 2 -- United States Patent no. D1,068,255, issued on April 1, was assigned to Hamee Global Inc. (Seoul, South Korea).
"Cover for earphone case" was invented by Bum Joon Lee (Seoul, South Korea) and Kwang Min Yuk (Seoul, South Korea).
The patent was filed on Nov. 10, 2023, under Application No. D/519,854.
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