US Patent Issued to Hamamatsu Photonics on Oct. 7 for "External resonant laser module and method of manufacturing external resonant laser module" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,339, issued on Oct. 7, was assigned to Hamamatsu Photonics K.K. (Hamamatsu, Japan).

"External resonant laser module and method of manufacturing external resonant laser module" was invented by Atsushi Sugiyama (Hamamatsu, Japan) and Tadataka Edamura (Hamamatsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The laser module includes a QCL element, a diffraction grating unit, a first lens holder, a second lens holder, and a mount member. The fourth mounting portion of the mount member is provided with a placement hole into which the protruding portion of the diffraction grating unit is inserted. The placement hole is longer than the protruding po...