US Patent Issued to HAMAMATSU PHOTONICS on Oct. 14 for "Laser machining apparatus, laser machining method, and method for manufacturing semiconductor member" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,440,925, issued on Oct. 14, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan).

"Laser machining apparatus, laser machining method, and method for manufacturing semiconductor member" was invented by Takeshi Sakamoto (Hamamatsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laser processing device includes: a light source configured to output laser light; a space light modulator for modulating the laser light output from the light source in accordance with a modulation pattern and outputting the modulated laser light; a converging lens for converging the laser light output from the space light modulator to an object, and forming a conve...