US Patent Issued to HAMAMATSU PHOTONICS on Nov. 4 for "Solid-state imaging device by compressive sensing technique" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,268, issued on Nov. 4, was assigned to HAMAMATSU PHOTONICS K.K. (Shizuoka, Japan).

"Solid-state imaging device by compressive sensing technique" was invented by Keisuke Uchida (Hamamatsu, Japan), Munenori Takumi (Hamamatsu, Japan), Yukinobu Sugiyama (Hamamatsu, Japan), Katsuhiro Ishii (Hamamatsu, Japan) and Ken-Ichi Kitayama (Hamamatsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solid-state imaging device includes a pixel array unit, a row control unit, a row readout unit, a column control unit, and a column readout unit. The pixel array unit includes MN pixels each including a photodiode for generating charges by receiving light and arra...