ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,766, issued on June 10, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan).
"Laser processing method, semiconductor device manufacturing method, and examination device" was invented by Takeshi Sakamoto (Hamamatsu, Japan), Yasutaka Suzuki (Hamamatsu, Japan) and Iku Sano (Hamamatsu, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An inspecting device includes a stage configured to support a wafer in which a plurality of rows of modified regions are formed in a semiconductor substrate, a light source configured to output, an objective lens configured to pass light propagated through the semiconductor substrate, a light detection part conf...