US Patent Issued to HAMAMATSU PHOTONICS on July 1 for "Wafer conveyance unit and wafer conveyance method" (Japanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,718, issued on July 1, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan).

"Wafer conveyance unit and wafer conveyance method" was invented by Akira Shimase (Hamamatsu, Japan), Toshimichi Ishizuka (Hamamatsu, Japan) and Masataka Ikesu (Hamamatsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A failure analysis unit is a wafer conveyance unit configured to convey a wafer while holding the wafer in a semiconductor failure analysis apparatus, the wafer conveyance unit including: a placement table configured to fix a wafer at a predetermined observation position; and a wafer chuck configured to convey the wafer while holding the wafer to ...