ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,125, issued on April 8, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan).
"Laser processing device and laser processing method" was invented by Takafumi Ogiwara (Hamamatsu, Japan) and Hayate Joan (Hamamatsu, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A laser processing device includes: a laser irradiation unit; and a control unit. The control unit is configured to execute a first control to control the laser irradiation unit to form modified regions for division along each of lines extending in an X direction and cracks extending from the modified regions in a direction of a surface, a second control to control the laser irradia...