US Patent Issued to HAMAMATSU PHOTONICS, National University Corporation Tokai National Higher Education and Research System on Nov. 18 for "Laser processing method, semiconductor member manufacturing method, and laser processing device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,587, issued on Nov. 18, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan) and National University Corporation Tokai National Higher Education and Research System (Nagoya, Japan).

"Laser processing method, semiconductor member manufacturing method, and laser processing device" was invented by Atsushi Tanaka (Nagoya, Japan), Chiaki Sasaoka (Nagoya, Japan), Hiroshi Amano (Nagoya, Japan), Daisuke Kawaguchi (Hamamatsu, Japan), Yotaro Wani (Hamamatsu, Japan), Yasunori Igasaki (Hamamatsu, Japan) and Toshiki Yui (Hamamatsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a laser processing method for cutting a semiconductor ...