ALEXANDRIA, Va., March 12 -- United States Patent no. D1,066,449, issued on March 11, was assigned to HAKKO Corp. (Osaka, Japan).
"Solder bath" was invented by Kenta Nakamura (Osaka, Japan), Hiroyuki Masaki (Osaka, Japan) and Tomoyo Maeshima (Osaka, Japan).
The patent was filed on Jan. 6, 2023, under Application No. D/881,861.
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