US Patent Issued to HAESUNG DS on Oct. 28 for "Multilayer circuit board manufacturing apparatus and multilayer circuit board manufacturing method" (South Korean Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,457,694, issued on Oct. 28, was assigned to HAESUNG DS Co. LTD. (Gyeongsangnam-Do, South Korea).

"Multilayer circuit board manufacturing apparatus and multilayer circuit board manufacturing method" was invented by Sang Min Lee (Gyeongsangnam-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a multilayer circuit board manufacturing apparatus and a multilayer circuit board manufacturing method. The present disclosure includes: a plurality of uncoilers configured to supply a plurality of different members; and a compressing machine configured to bond the members, which are supplied from the respective uncoilers, to each other. Th...