ALEXANDRIA, Va., June 19 -- United States Patent no. 12,331,233, issued on June 17, was assigned to GUANGZHOU BAIYUN TECHNOLOGY Co. LTD. (Guangdong, China) and GUANGDONG BAIYUN TECHNOLOGY Co. LTD. (Guangdong, China).
"Modified epoxy acrylate prepolymer, photo-thermal dual-curing conductive adhesive, and preparation method therefor" was invented by Chaobo Feng (Guangdong, China), Xingyuan Lou (Guangdong, China), Canguang Li (Guangdong, China), Jianjun Chen (Guangdong, China) and Hengchao Huang (Guangdong, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are an organic dibasic acid modified epoxy acrylate prepolymer and a photo-thermal dual-curing conductive adhesive prepared from the modified ep...