US Patent Issued to Guangdong Willing Technology on July 1 for "Flexible heat preservation board with heating wire encapsulated therein" (Chinese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,244, issued on July 1, was assigned to Guangdong Willing Technology Corp. (Huizhou, China).

"Flexible heat preservation board with heating wire encapsulated therein" was invented by Jingnong Ye (Guangdong, China), Shifa Luo (Guangdong, China) and Kunhuan Feng (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A flexible heat preservation board with heating wire encapsulated therein includes a heating pad, a heating wire and a liquid adhesive. A first side of the heating pad is defined with a groove and arranged with a plurality of projections. The heating pad is provided with a power supplier. Inner surfaces of the groove are provided w...