US Patent Issued to GREATER SHINE on Nov. 25 for "Modular 5G UE layer-2 data stack solutions for high throughput and low latency data transfer" (California Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,640, issued on Nov. 25, was assigned to GREATER SHINE Ltd. (New Taipei, Taiwan).

"Modular 5G UE layer-2 data stack solutions for high throughput and low latency data transfer" was invented by Su-Lin Low (San Diego), Tianan Tim Ma (San Diego), Hong Kui Yang (San Diego), Hausting Hong (San Diego), Chun-I Lee (San Diego) and Jianzhou Li (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods for providing a layer-2 data stack solution in a data plane and associated devices are provided. In some embodiments, the method includes (i) determining, among a plurality of data stack solutions that are selectable, which layer-2 data stack solution is ...