ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,657, issued on July 29, was assigned to GRAPHCORE Ltd. (Bristol, Great Britain).
"Stacked integrated circuit device" was invented by Stephen Felix (Bristol, Great Britain), Phillip Horsfield (Bristol, Great Britain) and Simon Jonathan Stacey (Bristol, Great Britain).
According to the abstract* released by the U.S. Patent & Trademark Office: "The first logic wafer is attached to a supporting wafer, which adds sufficient depth to this bonded structure such that the first logic wafer may be thinned during the manufacturing process. The first logic wafer is thinned such that the through silicon vias may be etched in the substrate of the first logic wafer so as to provide adequate con...