US Patent Issued to GRAND PROCESS TEHCNOLOGY on Aug. 12 for "Single wafer spin cleaning apparatus with soaking, cleaning, and etching functions" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,970, issued on Aug. 12, was assigned to GRAND PROCESS TEHCNOLOGY CORP. (Hsinchu, Taiwan).

"Single wafer spin cleaning apparatus with soaking, cleaning, and etching functions" was invented by Li-tso Huang (Hsinchu, Taiwan), Hsiu-kai Chang (Hsinchu, Taiwan), Chin-yuan Wu (Hsinchu, Taiwan) and Ming-che Hsu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A single wafer spin cleaning apparatus with soaking, cleaning, and etching functions in accordance with the present invention includes a spin driver device, a wafer spin chuck, and a wafer support disk. The wafer spin chuck is driven by the spin driver device to spin. The wafer support d...