US Patent Issued to GRAND PROCESS TECHNOLOGY on Sept. 30 for "Integrated wafer debonding and cleaning apparatus and debonding and cleaning method" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,382, issued on Sept. 30, was assigned to GRAND PROCESS TECHNOLOGY Corp. (Hsinchu, Taiwan).

"Integrated wafer debonding and cleaning apparatus and debonding and cleaning method" was invented by Chih-cheng Wang (Hsinchu, Taiwan), Zong-en Wu (Hsinchu, Taiwan) and Yun-cheng Chiu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated wafer debonding and cleaning apparatus and a debonding and cleaning method are provided. The integrated wafer debonding and cleaning apparatus includes an input port, a debonding module, a wafer cleaning device, and a transport device. The input port is configured to allow a substrate to be processed ...