ALEXANDRIA, Va., June 4 -- United States Patent no. 12,321,084, issued on June 3, was assigned to GoPro Inc. (San Mateo, Calif.).
"Interconnect mechanism for image capture device" was invented by Bessy Wen-Han Liang (San Jose, Calif.), Nicholas D. Woodman (Big Sky, Mont.), Nicholas Vitale (Foster City, Calif.) and Huy Phuong Nguyen (Alpine, Utah).
According to the abstract* released by the U.S. Patent & Trademark Office: "A camera housing includes a first surface and a second surface noncoplanar with the first surface. A first interconnect mechanism is coupled to the first surface and rotatable between a collapsed position and an extended position. In the collapsed position, protrusions of the first interconnect mechanism extend parallel ...