US Patent Issued to Google on Sept. 23 for "Compliant pad spacer for three-dimensional integrated circuit package" (California Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,509, issued on Sept. 23, was assigned to Google LLC (Mountain View, Calif.).

"Compliant pad spacer for three-dimensional integrated circuit package" was invented by Emad Samadiani (Cypress, Calif.), Padam Jain (San Jose, Calif.), Yingshi Tang (Danville, Calif.), Sue Yun Teng (Belmont, Calif.), Nicholas Chao Wei Wong (San Jose, Calif.), Kieran Miller (Palo Alto, Calif.) and Sudharshan Sugavanesh Udhayakumar (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A compliant pad spacer utilized in a three-dimensional IC packaging is provided. The compliant pad spacer may be utilized to provide adequate support among the substrates or boards,...