ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,227, issued on Nov. 18, was assigned to Google LLC (Mountain View, Calif.).
"Socket to support high performance multi-die ASICs" was invented by Nam Hoon Kim (San Jose, Calif.), Jaesik Lee (San Jose, Calif.), Woon-Seong Kwon (Santa Clara, Calif.) and Teckgyu Kang (Saratoga, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic system may include a microelectronic component having electrically conductive elements exposed at a first surface thereof, a socket mounted to a first surface of the microelectronic component and including a substrate embedded therein, one or more microelectronic elements each having active semiconductor devi...