ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,860, issued on May 27, was assigned to Google LLC (Mountain View, Calif.).
"Integrated circuit package for high bandwidth memory" was invented by Nam Hoon Kim (San Jose, Calif.), Woon-Seong Kwon (Santa Clara, Calif.), Teckgyu Kang (Saratoga, Calif.) and Yujeong Shim (Cupertino, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package including a substrate configured to receive one or more high-bandwidth memory (HBM) stacks on the substrate, an interposer positioned on the substrate and configured to receive a logic die on the interposer, a plurality of interposer channels formed in the interposer and connecting the logic d...