US Patent Issued to Google on March 18 for "Signal routing in integrated circuit packaging" (California Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,129, issued on March 18, was assigned to Google LLC (Mountain View, Calif.).

"Signal routing in integrated circuit packaging" was invented by Jin Young Kim (Mountain View, Calif.) and Zhonghua Wu (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some implementations, a substrate for coupling to an integrated circuit includes multiple layers. Each of the multiple layers has, in a particular region of the substrate, a repeating pattern of regions corresponding to power and ground. The multiple layers include (i) a top layer having, in the particular region, power contacts and ground contacts for coupling to an integrated circuit and ...