US Patent Issued to Google on June 10 for "ASIC package with photonics and vertical power delivery" (California Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,817, issued on June 10, was assigned to Google LLC (Mountain View, Calif.).

"ASIC package with photonics and vertical power delivery" was invented by Woon-Seong Kwon (Santa Clara, Calif.), Nam Hoon Kim (San Jose, Calif.), Teckgyu Kang (Saratoga, Calif.) and Ryohei Urata (San Carlos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic m...