ALEXANDRIA, Va., April 9 -- United States Patent no. 12,274,079, issued on April 8, was assigned to Google LLC (Mountain View, Calif.).
"Deep trench capacitors embedded in package substrate" was invented by Nam Hoon Kim (San Jose, Calif.), Teckgyu Kang (Saratoga, Calif.), Scott Lee Kirkman (Menlo Park, Calif.) and Woon-Seong Kwon (Santa Clara, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure relates to deep trench capacitors embedded in a package substrate on which an integrated circuit is mounted. In some aspects, a chip package includes an integrated circuit die that has a power distribution circuit for one or more circuits of the integrated circuit. The chip package also includes a su...