US Patent Issued to Google on April 15 for "Methods and heat distribution devices for thermal management of chip assemblies" (California, New York Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,160, issued on April 15, was assigned to Google LLC (Mountain View, Calif.).

"Methods and heat distribution devices for thermal management of chip assemblies" was invented by Woon-Seong Kwon (Santa Clara, Calif.), Yuan Li (Sunnyvale, Calif.) and Zhi Yang (Fresh Meadow, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to an aspect of the disclosure, an example microelectronic device assembly includes a substrate, a microelectronic element electrically connected to the substrate, a stiffener element overlying the substrate, and a heat distribution device overlying the rear surface of the microelectronic element. The stiffener element may e...