US Patent Issued to GONG YI VAN-RESEARCH INNOVATION COMPOSITE MATERIAL on March 25 for "Sandwich composite board and preparation method thereof" (Chinese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,815, issued on March 25, was assigned to GONG YI VAN-RESEARCH INNOVATION COMPOSITE MATERIAL Co. LTD (Henan, China).

"Sandwich composite board and preparation method thereof" was invented by Xizong Liu (Zhengzhou, China), Jicheng Zhang (Zhengzhou, China), Huina Dong (Zhengzhou, China), Fengxia He (Zhengzhou, China), Xiangming Gong (Zhengzhou, China), Dongjia Yao (Zhengzhou, China) and Dongsheng Zhang (Zhengzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure relates to a sandwich composite board and a preparation method thereof. The sandwich composite board includes, from top to bottom, an upper panel layer, a core material laye...