US Patent Issued to GOERTEK MICROELECTRONICS on Dec. 16 for "Vibration sensor module and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,196, issued on Dec. 16, was assigned to GOERTEK MICROELECTRONICS INC. (Qingdao, China).

"Vibration sensor module and electronic device" was invented by Huabin Fang (Qingdao, China) and Luyu Duanmu (Qingdao, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A vibration sensor module including: a substrate, a first casing, a vibration pickup unit, and a sensor unit. The first casing has an open end on the substrate, the first casing and the substrate are enclosed to form a sealing chamber, and the first casing includes a first top plate opposite to the substrate. The vibration pickup unit is arranged in the sealing chamber, the vibration pickup uni...