US Patent Issued to GM Global Technology Operations on Oct. 28 for "Thermally conducting bracket for busbar to cold plate heat transfer" (Michigan Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,855, issued on Oct. 28, was assigned to GM Global Technology Operations LLC (Detroit).

"Thermally conducting bracket for busbar to cold plate heat transfer" was invented by Abdullah-Al Mamun (Northville, Mich.), Chih-Cheng Hsu (Bloomfield Township, Mich.), Charles Hua (Novi, Mich.) and Igor M. Kan (Waterford, Mich.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermally conductive bracket is contemplated for use in a vehicle to facilitate transfer heat from a busbar to a cold plate, such as to assist with heat transfer to a cold plate used to act as a heat sink for a plurality of battery cells connected to the busbar. The bracket may include a th...