ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,420,376, issued on Sept. 23, was assigned to GlobalWafers Co. Ltd. (Hsinchu, Taiwan).
"Polishing head assembly having recess and cap" was invented by Chih Yuan Hsu (Hsinchu, Taiwan), Jen Chieh Lin (Hsinchu, Taiwan), Chieh Hu (Chiayi, Taiwan), Wei Chang Huang (Hsinchu County, Taiwan) and Yau-Ching Yang (Zhubei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing head assembly for polishing of semiconductor wafers includes a polishing head and a cap. The polishing head has a recess along a bottom portion. The recess has a recessed surface. The cap is positioned within the recess. The cap includes an annular wall secured to the polishing hea...