US Patent Issued to GlobalWafers on Nov. 25 for "Wafer processing apparatus including rotatable element connected to pressure applying element" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,677, issued on Nov. 25, was assigned to GlobalWafers Co. Ltd. (Hsinchu, Taiwan).

"Wafer processing apparatus including rotatable element connected to pressure applying element" was invented by Hsiu Chi Liang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing apparatus includes a pressure applying element, a rotatable element, a control element, and a heat source. The pressure applying element includes a first pressure applying head having a first working surface and a second pressure applying head having a second working surface. The rotatable element and the pressure applying element are connected. The control elemen...