US Patent Issued to GlobalWafers on March 18 for "Systems and methods for a preheat ring in a semiconductor wafer reactor" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,252,806, issued on March 18, was assigned to GlobalWafers Co. Ltd (Hsinchu, Taiwan).

"Systems and methods for a preheat ring in a semiconductor wafer reactor" was invented by Chieh Hu (Chiayi, Taiwan) and Chun-Chin Tu (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A reaction apparatus includes an upper dome, a lower dome, an upper liner, a lower liner, and a preheat ring. The upper dome and the lower dome define a reaction chamber. The preheat ring is positioned within the reaction chamber for heating the process gas prior to contacting the semiconductor wafer. The preheating ring is attached to an inner circumference of the lower liner...