US Patent Issued to GlobalWafers on June 17 for "Cleave systems having spring members for cleaving a semiconductor structure and methods for cleaving such structures" (Missouri Inventor)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,369, issued on June 17, was assigned to GlobalWafers Co. Ltd. (Hsinchu, Taiwan).

"Cleave systems having spring members for cleaving a semiconductor structure and methods for cleaving such structures" was invented by Justin Scott Kayser (Wentzville, Mo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Cleave systems for cleaving a semiconductor structure are disclosed. The cleave systems may include a cleave arm that is moveable from a starting position to a raised position in which a cleave stress is applied to the semiconductor structure. Spring members store energy as the cleave arm is raised with the stored spring energy causing the structure to cl...