US Patent Issued to GlobalWafers on Dec. 30 for "Wafer jig, wafer structure and wafer processing method" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,359, issued on Dec. 30, was assigned to GlobalWafers Co. Ltd. (Hsinchu, Taiwan).

"Wafer jig, wafer structure and wafer processing method" was invented by Chan-Ju Wen (Hsinchu, Taiwan), Chia-Chi Tsai (Hsinchu, Taiwan) and Han-Zong Wu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a wafer jig including a bottom wall and a ring-shaped side wall. The bottom wall has a supporting surface. The ring-shaped side wall is connected to a periphery of the bottom wall. The ring-shaped side wall includes at least two step portions. The two step portions include a first step portion and a second step portion. The first step portion is ...