US Patent Issued to GlobalWafers on Dec. 23 for "Methods for manufacturing a semiconductor wafer using a preheat ring in a wafer reactor" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,792, issued on Dec. 23, was assigned to GlobalWafers Co. Ltd. (Hsinchu, Taiwan).

"Methods for manufacturing a semiconductor wafer using a preheat ring in a wafer reactor" was invented by Chieh Hu (Chiayi, Taiwan) and Chun-Chin Tu (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor wafer in a reaction apparatus comprising channeling a process gas into a reaction chamber through the process gas inlet and heating the process gas with the preheat ring having an edge bar. The method also includes adjusting at least one of a velocity and a direction of the process gas with the edge bar, and depositing a...