US Patent Issued to GlobalWafers on Dec. 2 for "Systems and methods for processing semiconductor wafers using front-end processed wafer edge geometry metrics" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,487,185, issued on Dec. 2, was assigned to GlobalWafers Co. Ltd. (Hsinchu, Taiwan).

"Systems and methods for processing semiconductor wafers using front-end processed wafer edge geometry metrics" was invented by Yung Hsing Chu (Zhubei, Taiwan), Yen-Chun Chou (Taoyuan, Taiwan), Yau-Ching Yang (Zhubei, Taiwan), Jing Ru Hong (Zhubei, Taiwan) and Shan-Hui Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for processing semiconductor wafers includes obtaining measurement data of an edge profile of a semiconductor wafer processed by a front-end process tool. The method includes determining an edge profile center point based on the me...