US Patent Issued to GlobalWafers on Aug. 12 for "Systems and methods for generating post-polishing topography for enhanced wafer manufacturing" (Missouri Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,386,340, issued on Aug. 12, was assigned to GlobalWafers Co. Ltd. (Hsinchu, Taiwan).

"Systems and methods for generating post-polishing topography for enhanced wafer manufacturing" was invented by Vahid Khalajzadeh (O'Fallon, Mo.) and Sumeet S. Bhagavat (St. Charles, Mo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A computer device is programmed to store a model for converting shape maps to simulate a portion of an assembly line, receive scan data of a first inspection of a product being assembled, generate a shape map from the scan data of the first inspection, execute the model using the shape map as an input to generate a final shape map of the pr...