US Patent Issued to GlobalWafers on Aug. 12 for "Semiconductor wafers using front-end processed wafer global geometry metrics" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,385,850, issued on Aug. 12, was assigned to GlobalWafers Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor wafers using front-end processed wafer global geometry metrics" was invented by Yung Hsing Chu (Zhubei, Taiwan), Yen-Chun Chou (Taoyuan, Taiwan) and Shan-Hui Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for processing semiconductor wafers includes obtaining measurement data from a surface of a semiconductor wafer processed by a front-end process tool. The method includes determining a center plane of the wafer based on the measurement data, generating raw shape profiles, and generating ideal shape profiles. The method furth...