US Patent Issued to GLOBALWAFERS JAPAN on Dec. 2 for "Lamination wafers and method of producing bonded wafers using the same" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,488,979, issued on Dec. 2, was assigned to GLOBALWAFERS JAPAN Co. LTD. (Niigata, Japan).

"Lamination wafers and method of producing bonded wafers using the same" was invented by Tatsuhiko Aoki (Niigata, Japan) and Manabu Hirasawa (Niigata, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The occurrence of breaking and chipping at the wafer peripheral edge of a bonded wafer obtained by bonding a lamination wafer on a support wafer is suppressed. A lamination wafer to be bonded to a support wafer includes a large-diameter portion made of a silicon wafer whose peripheral edge is chamfered and a small-diameter portion, whose diameter is smaller than that...