US Patent Issued to GlobalFoundries U.S. on Sept. 16 for "Device integration schemes leveraging a bulk semiconductor substrate having a greater than111less than crystal orientation" (Vermont, New York Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,419,098, issued on Sept. 16, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.).

"Device integration schemes leveraging a bulk semiconductor substrate having a greater than111less than crystal orientation" was invented by Mark Levy (Williston, Vt.), Jeonghyun Hwang (Ithaca, N.Y.) and Siva P. Adusumilli (South Burlington, Vt.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Structures including devices, such as transistors, integrated on a bulk semiconductor substrate and methods of forming a structure including devices, such as transistors, integrated on a bulk semiconductor substrate. The bulk semiconductor substrate contains a single-crystal semic...