US Patent Issued to GlobalFoundries U.S. on Nov. 4 for "Cladding structure in the back end of line of photonics chips" (New York Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,312, issued on Nov. 4, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.).

"Cladding structure in the back end of line of photonics chips" was invented by Ryan Sporer (Mechanicville, N.Y.), Karen Nummy (Newburgh, N.Y.), Keith Donegan (Saratoga Springs, N.Y.), Thomas Houghton (Marlboro, N.Y.), Yusheng Bian (Ballston Lake, N.Y.), Takako Hirokawa (Ballston Lake, N.Y.) and Kenneth Giewont (Hopewell Junction, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "IC chips for photonics applications are disclosed. An example IC chip includes a substrate, an optical component above the substrate, and a first connection level above the substrate. The first...