US Patent Issued to GlobalFoundries U.S. on Jan. 13 for "Multi-substrate coupling for photonic integrated circuits" (New York Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,523,831, issued on Jan. 13, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.).

"Multi-substrate coupling for photonic integrated circuits" was invented by Ravi Prakash Srivastava (Clifton Park, N.Y.), Yusheng Bian (Ballston Lake, N.Y.) and Vibhor Jain (Clifton Park, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the disclosure provide a multi-substrate coupling for photonic integrated circuits (PICs). Structures of the disclosure may include a first substrate having a first surface. The first surface includes a groove therein. A second substrate has a second surface coupled to the first surface. The second substrate includes a ...