US Patent Issued to GlobalFoundries U.S. on Feb. 3 for "Photonic components with chamfered sidewalls" (New York Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,541,057, issued on Feb. 3, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.).

"Photonic components with chamfered sidewalls" was invented by Yusheng Bian (Ballston Lake, N.Y.), Kenneth Giewont (Hopewell Junction, N.Y.) and Takako Hirokawa (Ballston Lake, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Structures for a photonics chip that include a photonic component and methods of forming such structures. The structure may comprise a photodetector on a substrate and a waveguide core. The photodetector includes a light-absorbing layer having a longitudinal axis, a first sidewall, and a second sidewall adjoined to the first sidewall at an interio...